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PCB
Backplanes, HDI boards, High-frequency boards,High TG boards, Halogen-free boards,Aluminium Core PCB, and any boards with applications in high-tech products.
Technical Support:
Layers Mass production: 2~58 layers / Pilot run: 64 layers
Max. Thickness Mass production: 394mil (10mm) / Pilot run: 17.5mm
Material FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,  PPO, PPE, Hybrid, Partial hybrid, etc.
Min. Width/Spacing Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ)
Max. Copper Thickness UL certificated: 6.0 OZ / Pilot run: 12OZ
Min. Hole Size Mechanical drill: 8mil(0.2mm)  Laser drill: 3mil(0.075mm)
Max. Panel Size 1150mm × 560mm
Aspect Ratio 18:1
Surface Finish HASL、Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger
Special Process Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control.
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